Since the hydrolysis process of silicone resin is an exothermic process, the hydrolysis temperature has a great relationship with the formation of gels. Gels are more likely to be produced at lower temperatures because the activity of difunctional monomers and trifunctional groups are lower at lower temperatures. The activity gap is very large, the difunctional monomers are more likely to self-polymerize to form a gel with a high degree of cross-linking. As the reaction temperature increases, the activity of the difunctional monomers also participates in the reaction with stirring. As the reaction temperature is further increased, the formed silanol is easily further cross-linked to form a silicone resin.

The quality of organic material processing and synthesis is more stable. Silicone resin manufacturers indicate that silicone is a product worth recommending and choosing. Its appearance can not only achieve outstanding improvements in the effects of safety and robustness, but also make significant improvements in quality. Help more friends recognize its particularity during use, thereby helping production and processing manufacturers to meet their hearts in terms of processing quality.

There are various classification methods of silicone resins according to the main chain structure. They can be divided into pure silicone resins and modified silicone resins. The former is a typical polysiloxane structure and the latter is a polysilicon hybridized with a thermosetting silicone resin Oxane.

Condensation type: high heat resistance, good adhesion and low cost, but also has disadvantages such as difficulty in foaming and functional control. It can be used as coatings, laminates, and adhesives.

Addition molding: Silicone resin has the advantages of easy control of non-foaming deformation and small reaction.

Peroxide type: the advantages of no solvation, low temperature curing and long storage period, but air will hinder the curing of silicone resin, and it can be used as impregnating paint and adhesive and laminate.